Resin Bonded Silicon Carbide Segment 100x64/57x25mm

key word:

Silicon Carbide Segment

Resin Bonded


Description

The abrasive blend combines black silicon carbide (C) and green silicon carbide (GC) grains in a high-strength resinoid bond. This hybrid formulation balances aggressive stock removal with controlled surface finish—black SiC contributes toughness and cutting efficiency on hard, brittle materials, while green SiC promotes cooler cutting and finer finish consistency. The medium-soft H hardness grade encourages self-sharpening behavior, maintaining free cutting throughout the tool life without requiring frequent dressing.
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    Resin Bonded Silicon Carbide Segment — C/GC54H7BYX

    Custom-Manufactured Edge Grinding Segment for Stone, Ceramic & Concrete

    Product Overview

    This resin-bonded silicon carbide segment is engineered for edge grinding and chamfering operations on stone, ceramic tile, and concrete processing lines. The trapezoidal profile is specifically designed to match edge-grinding head geometry, ensuring precise contact and uniform material removal along tile and slab edges.

    The abrasive blend combines black silicon carbide (C) and green silicon carbide (GC) grains in a high-strength resinoid bond. This hybrid formulation balances aggressive stock removal with controlled surface finish—black SiC contributes toughness and cutting efficiency on hard, brittle materials, while green SiC promotes cooler cutting and finer finish consistency. The medium-soft H hardness grade encourages self-sharpening behavior, maintaining free cutting throughout the tool life without requiring frequent dressing.

    Model: C/GC54H7BYX
    Dimensions: 100 × 64/57 × 25 mm (outer diameter × inner step diameter × thickness)

    Key Features

    Hybrid C/GC Abrasive Blend
    Black and green silicon carbide grains are combined to deliver both fast stock removal and consistent edge finish. The blend adapts well to mixed production runs involving granite, engineered stone, porcelain tile, and concrete.

    Resinoid Bond for Vibration Damping
    The resin bond absorbs the impact and vibration typical of high-speed edge grinding lines, reducing chipping risk on brittle ceramic edges and extending segment life under continuous operation.

    Self-Sharpening H Hardness
    Medium-soft hardness promotes controlled grain release as cutting edges dull, exposing fresh abrasive and maintaining steady cut rates. This reduces burn risk on heat-sensitive ceramic surfaces.

    Open Structure (Grade 7)
    The open structure design provides efficient chip and slurry clearance, minimizing loading and glazing during wet or dry grinding. This is particularly important when processing concrete and stone, where fines can quickly pack the wheel face.

    Trapezoidal Profile
    The trapezoidal cross-section is purpose-built for edge grinding and chamfering geometry, ensuring consistent contact angle and even wear across the segment face.

    Technical Specifications

    Parameter

    Specification

    Model Code

    C/GC 54 H 7 B YX

    Bond Type

    Resinoid (B)

    Abrasive Material

    Black Silicon Carbide (C) / Green Silicon Carbide (GC) blend

    Grit Size

    F54 (medium-coarse)

    Hardness

    H (medium-soft, self-sharpening)

    Structure

    7 (open, chip-clearance optimized)

    Dimensions

    100 × 64/57 × 25 mm

    Profile

    Trapezoidal

    Primary Application

    Edge grinding and chamfering

    Work Material

    Stone, ceramic tile, concrete

    Equipment Type

    Stone/ceramic edge grinding lines

    Customization

    Grit, hardness, dimensions, and profile available on request

    Model Code Breakdown

    Code Segment

    Meaning

    C/GC

    Black / green silicon carbide abrasive blend

    54

    Grit size F54

    H

    Hardness grade H (medium-soft)

    7

    Structure number 7 (open)

    B

    Resinoid bond

    YX

    Manufacturer profile/application designation

    Application Guidelines

    Recommended Operating Conditions

    Parameter

    Recommendation

    Mounting

    Verify segment seat alignment and clamping torque; trapezoidal profile must seat flush against grinding head

    Speed

    Operate within the resinoid bond’s rated peripheral speed; resin bonds are heat-sensitive

    Cooling

    Wet grinding recommended for dust suppression and edge quality; if dry, use dust extraction

    Break-in

    Brief light-load run-in helps seat the segment and expose fresh grain

    Dressing

    If glazing occurs, a light dress restores cutting action; monitor spindle load as an indicator

    Suitable Materials

    Granite, marble, and engineered stone edges

    Porcelain and ceramic tile chamfering

    Concrete edge finishing and profiling

    Compatibility Note
    This segment is a custom-manufactured item. Customers should confirm machine spindle interface, mounting dimensions, and operating speed range before ordering. Custom grit, hardness, and profile modifications are available to suit specific production line requirements.

    Customization & OEM Capability

    As a custom product, the C/GC54H7BYX can be adapted to meet specific customer requirements:

    Customization Option

    Available Range

    Grit size

    Coarser or finer grades on request

    Hardness

    Softer or harder resin bond formulations

    Dimensions

    Adjusted to match existing mounting geometry

    Profile

    Modified trapezoidal or alternative edge profiles

    Packaging

    Private labeling and custom carton configurations

    Ordering Information

    MOQ: Contact for minimum order quantity

    Lead Time: Confirmed at order placement

    Sample Policy: Evaluation samples available for qualified buyers

    Documentation: Product specification sheets and material safety documentation provided upon request

    FAQ

    Q: What materials is this segment designed for?
    A: The C/GC blend is formulated for stone, ceramic tile, and concrete edge grinding. Black SiC provides cutting efficiency on hard, brittle materials, while green SiC contributes to cooler cutting and finish consistency.

    Q: Is this a standard stock item?
    A: This is a custom-manufactured segment. Specifications can be tailored to your machine and production requirements. Contact us with your application details for a recommendation.

    Q: Can you modify the dimensions or profile?
    A: Yes. The 100 × 64/57 × 25 mm dimensions and trapezoidal profile can be adjusted to fit existing mounting arrangements. Provide a drawing or sample for reference.

    Q: What is the recommended operating speed?
    A: Operating speed depends on the specific resin bond formulation and machine setup. Confirm the rated peripheral speed with our technical team before operation.

    Q: Do you offer samples for testing?
    A: Evaluation samples are available for qualified buyers. Contact us with your application details and machine specifications.

    Q: What is the lead time for custom orders?
    A: Lead time varies based on specification complexity and order quantity. Confirmed at the time of order placement.

     

    Key words:
    • Silicon Carbide Segment
    • Resin Bonded